SW ADHESIVE
No-Clean Rosin Flux for PCB Assembly
Low-residue rosin flux designed for wave and selective soldering of printed circuit boards.
Highlights
- No-clean residue, IPC-A-610 qualified
- Halogen-free, <500 ppm halogen content
- IPC J-STD-004 ORL0 classification
- RoHS 2 compliant
- Activation temperature 120°C, peak 210°C
- Fine pitch (0.3 mm) BGA compatible
- Viscosity 500-700 cP for stencil and dispense
- Bottle and stencil application methods
Specifications
| Classification | IPC J-STD-004 ORL0 |
|---|---|
| Halogen Content | <500 ppm |
| Activation Temperature | 120°C |
| Peak Performance | 210°C |
| Certifications | RoHS 2, IPC-A-610 qualified |
Product Detail
A halogen-free no-clean rosin flux classified to IPC J-STD-004 ORL0, designed for PCB assembly operations where post-solder cleaning is impractical or cost-prohibitive. Activates at 120°C with peak performance at 210°C, compatible with 0.3 mm fine-pitch BGA rework and general electronic assembly.
Verified Product Specifications
What ORL0 Classification Means for Your Process
The IPC J-STD-004 ORL0 classification tells you three things at a glance: this is a rosin-based flux (R), it has low activity (L), and it contains no halides (0). In practical terms, ORL0 fluxes produce residues that are considered benign and non-corrosive, which is why no-clean processing is acceptable for most PCB assembly applications without a post-solder wash step.
The <500 ppm halogen content aligns with halogen-free requirements adopted by electronics manufacturers targeting IEC 61249-2-21 or equivalent internal material restrictions. If your assembly process serves customers with explicit halogen-free mandates, this specification is the starting point for compliance documentation.
No-Clean Residue
Designed to leave residues that do not require removal after soldering at 210°C, reducing process steps.
Dual Application
500–700 cP viscosity supports both precision bottle dispensing and stencil printing methods.
Fine-Pitch BGA
Confirmed compatible with 0.3 mm fine-pitch BGA components for high-density PCB assembly.
IPC-A-610 Qualified
Solder joints produced with this flux meet IPC-A-610 acceptability criteria for electronic assemblies.
Application and Process Considerations
The flux activates at 120°C, meaning it begins removing surface oxides from copper pads and component leads as the assembly heats toward soldering temperature. Peak performance occurs at 210°C, which aligns with standard tin-lead and lead-free solder reflow profiles. For hand soldering, this temperature range corresponds to typical iron tip contact temperatures.
The 500–700 cP viscosity at 25°C is specified for both stencil and dispense application methods. At this viscosity range, the flux flows through dispensing needles without excessive back-pressure while maintaining enough body to hold position on copper pads during component placement. For stencil printing, the viscosity supports transfer through standard aperture geometries.
The light brown liquid is supplied in a bottle with a precision needle-tip nozzle for manual dispensing, as shown in the product imagery. Stencil-grade application requires compatible printing equipment and process parameters specific to your production line.
In-house quality testing laboratory — viscosity and performance validation conducted on every production batch.
Manufacturer Backing
Manufactured by TIANJIN SHENGWANG ELECTRONIC CHEMICAL PLANT, a specialist producer of industrial adhesives, sealants, and electronic chemical products based in Tianjin, China. Founded in 1993, the facility serves global B2B buyers with RoHS/REACH-compliant products for electronics manufacturing. The company holds ISO 9001:2015 certification for quality management systems, with in-house testing laboratories equipped to validate viscosity and performance consistency across production batches.
Buyer FAQ
Is this flux truly halogen-free, and what standard does the <500 ppm figure reference?
The documented specification confirms halogen content below 500 ppm. This is the product's stated halogen content limit. For specific compliance against your customer's internal halogen-free standard (such as IEC 61249-2-21 or J-STD-709), request a certificate of analysis or material declaration sheet through inquiry.
Can I use this flux for 0.3 mm fine-pitch BGA assembly?
Yes. The product is explicitly confirmed compatible with 0.3 mm fine-pitch BGA components. The 500–700 cP viscosity supports both precision dispense and stencil printing for fine-pitch applications.
Do I need to clean the residue after soldering?
This is a no-clean rosin flux. Per product design, post-soldering cleaning is not required. The ORL0 classification indicates low-activity, halide-free residue that is considered benign for most electronics assembly applications.
What soldering temperature profile does this flux require?
Activation begins at 120°C and peak performance occurs at 210°C. This range is compatible with standard reflow profiles and hand-soldering iron temperatures used in PCB assembly.
What packaging sizes and formats are available?
Packaging size and format options are available upon request. The product is shown in a precision dispensing bottle for manual application. For high-volume electronics manufacturing, bulk packaging and custom formats can be discussed based on your production requirements.
Are custom viscosity or activation temperature formulations available?
Custom formulation requests can be discussed with our technical team. Please share your specific process parameters and application requirements through the inquiry form.
Can you provide compliance documentation for RoHS 2 and IPC-A-610?
The product is documented as RoHS 2 compliant and IPC-A-610 qualified. Specific compliance certificates, material declarations, and test reports can be provided upon request — specify which documents your procurement process requires.
Request a Quote for Your PCB Assembly Project
Tell us your required order volume, preferred packaging format (dispensing bottle or stencil-grade container), soldering process details, and any specific compliance documentation your customer requires. Our technical sales team will respond with tailored pricing, lead time, and specification support.
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