SW ADHESIVE
No-Clean Rosin Flux for PCB Assembly
Low-residue rosin flux designed for wave and selective soldering of printed circuit boards.
Highlights
- No-clean residue, IPC-A-610 qualified
- Halogen-free, <500 ppm halogen content
- IPC J-STD-004 ORL0 classification
- RoHS 2 compliant
- Activation temperature 120°C, peak 210°C
- Fine pitch (0.3 mm) BGA compatible
- Viscosity 500-700 cP for stencil and dispense
- Bottle and stencil application methods
Specifications
| Classification | IPC J-STD-004 ORL0 |
|---|---|
| Halogen Content | <500 ppm |
| Activation Temperature | 120°C |
| Peak Performance | 210°C |
| Certifications | RoHS 2, IPC-A-610 qualified |
Product Detail
Rosin-based no-clean flux formulated for high-volume electronics manufacturing and repair operations. Residue remains on PCB after soldering at levels low enough to pass IPC-A-610 electrical insulation resistance (>10 MΩ) without aqueous wash. Flux activation begins at 120°C, reaching peak performance at 210°C during solder reflow. Wetting properties ensure solder flow across fine pitch (0.3 mm) BGA component leads without bridging. Meets IPC J-STD-004 classification ORL0 (no-clean) with halogen content <500 ppm, complying with RoHS 2 and halogen-free electronics assembly requirements in EU markets. Bottle dispensing and stencil application compatible; viscosity 500-700 cP at 25°C permits controlled application to pads and landing areas. Used in telecommunications, automotive electronics, and industrial control board manufacturing where post-solder cleaning is not feasible.sible.
