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Thermal Interface Materials
Thermally conductive adhesives and gap-fillers engineered for heat dissipation in LED assemblies, power electronics, and semiconductor packaging. Thermal conductivity 0.8–3.0 W/mK, low outgassing certified for space and automotive applications.
Thermal Conductive Adhesive
Thermal Conductive Silicone Adhesive
One-part RTV silicone adhesive that bonds heat sinks to electronic components while providing thermal conductivity of 1.5 W/mK. Cures at room temperature to form a permanent, flexible thermal joint.
Epoxy Adhesive
Two-Part Epoxy Structural Adhesive
High-strength two-part epoxy for metal, composites, and wood bonding with 24-hour full cure.
Thermal Interface
Thermal Interface Silicone Pad 5 W/mK
Compressible silicone thermal pad for CPU, GPU, and component heat dissipation.
Thermal Interface
Silicone Thermal Grease 3 W/mK
Pumpable thermal grease for direct application between heat sources and sinks.