SW ADHESIVE
Silicone Thermal Grease 3 W/mK
Pumpable thermal grease for direct application between heat sources and sinks.
Highlights
- Thermal conductivity 3 W/mK
- Non-curing, reworkable formulation
- Operating range -30°C to +150°C
- Extrusion <5% under compression
- Dielectric strength 1500 V/mm
- Washable, easy component replacement
- Bondline thickness 15-40 microns
- RoHS 2 compliant
Specifications
| Thermal Conductivity | 3 W/mK |
|---|---|
| Operating Temperature | -30°C to +150°C |
| Dielectric Strength | 1500 V/mm |
| Extrusion Resistance | <5% over 1000 hours at 50 kPa |
| Certifications | ISO 9001, RoHS 2 |
Product Detail
Silicone Thermal Grease 3 W/mK — Technical Overview
This non-curing silicone thermal grease is formulated for thermal interface management in electronics assembly. With a thermal conductivity of 3 W/mK, it bridges the gap between heat-generating components and heat sinks or spreaders, improving thermal transfer efficiency. The pumpable paste consistency supports manual and automated dispensing processes.
Key Performance Properties
- Extrusion resistance: <5% over 1000 hours at 50 kPa compression — the material stays in the bondline under sustained clamping force rather than pumping out.ut.
- Dielectric strength: 1500 V/mm — provides electrical isolation between the component and heatsink, reducing risk of electrical shorting.
- Bondline thickness: 15–40 microns recommended — ensures minimal thermal resistance at the interface without excess material.
- Reworkability: Washable formulation allows easy component removal, cleaning, and replacement — critical for rework and field service.
- Viscosity: 50,000–100,000 cP pumpable paste — compatible with screen printing, stencil application, and dispensing.
Applications and Selection Guidance
This thermal grease suits a range of electronics cooling scenarios where a reworkable interface is preferred over a bonded one:
- Microprocessors, CPUs, and GPUs to heatsink interfaces
- Power semiconductor modules (IGBTs, MOSFETs) in mid-power ranges
- LED lighting assemblies requiring thermal management
- Automotive electronics control units within the rated temperature range
- Any assembly where future component replacement or rework is anticipated
When to select a different TIM: If your application requires structural bonding alongside thermal transfer, a curing adhesive TIM may be more appropriate. If your power density demands conductivity above 3 W/mK, higher-grade pad or phase-change materials should be evaluated. This product is optimized for applications where reworkability, dielectric isolation, and stable pump-out resistance matter more than maximum thermal conductivity.
Full Specification Table
| Parameter | Value |
|---|---|
| Thermal Conductivity | 3 W/mK |
| Operating Temperature | -30°C to +150°C |
| Dielectric Strength | 1500 V/mm |
| Extrusion Resistance | <5% over 1000 hours at 50 kPakPa |
| Bondline Thickness | 15–40 microns |
| Color | Light gray |
| Viscosity | 50,000–100,000 cP (pumpable paste) |
| Cure Temperature | No cure required (non-curing formulation) |
| Product Certifications | RoHS 2 compliant |
Buyer FAQ
Manufacturer Background
Manufactured by Tianjin Shengwang Electronic Chemical Plant (SW Adhesive), an industrial adhesive and electronic chemical producer established in 1993 in Tianjin, China. The facility holds ISO 9001 quality management certification and maintains in-house testing capabilities for product performance validation.
ISO 9001 certification reflects the manufacturer's company-level quality management system. Product-specific compliance is limited to RoHS 2 as stated in the product specification. Additional certifications or test reports may be available upon request.est.
To help us provide accurate pricing and technical guidance, please share your required order volume, target application, preferred packaging format, and any specific documentation needs (e.g., RoHS 2 report, full datasheet).
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