SW ADHESIVE
Two-Part Epoxy Structural Adhesive
High-strength two-part epoxy for metal, composites, and wood bonding with 24-hour full cure.
Highlights
- 1:1 mix ratio, 25-minute pot life at room temperature
- 20+ MPa tensile shear strength on steel
- Full cure in 24 hours, handling strength in 4 hours
- Bonds metals, composites, wood without primers
- Clear amber color, low VOC formulation
- ISO 9001 certified, aerospace-grade quality
- Suitable for structural repairs and assembly
- No exothermic reaction hazard
Specifications
| Mix Ratio | 1:1 by weight |
|---|---|
| Pot Life | 25 minutes at 23°C |
| Tensile Shear Strength | 20 MPa on steel |
| Full Cure Time | 24 hours |
| Handling Strength | 4 hours |
| Certifications | ISO 9001 |
Product Detail
Performance Overview
This two-part epoxy structural adhesive is formulated for load-bearing bonds across metals, composites, and wood. It cures at room temperature (23°C) with a straightforward 1:1 mix ratio by weight, reaching handling strength in 4 hours and full cure in 24 hours. The thixotropic paste consistency supports controlled dispensing on vertical or overhead surfaces without sag. The cured bond line is clear amber in color. The formulation is low VOC and does not present an exothermic reaction hazard during cure.
Mix Ratio
1:1 by weight
Pot Life
25 min at 23°C
Tensile Shear Strength
20+ MPa on steel
Full Cure Time
24 hours at 23°C
Handling Strength
4 hours
Color
Clear amber
Viscosity
Thixotropic paste
Cure Temperature
Room temp (23°C)
Substrate Compatibility & Application Scopecope
This adhesive bonds metals, composites, and wood without requiring primers. The 20+ MPa tensile shear strength on steel makes it suitable for structural assembly and repair applications where load transfer across bonded joints is a design requirement. Typical application areas labeled for this product include aerospace assembly and general structural bonding of metal and composite substrates.
What this means for your assembly process
- Working window: 25-minute pot life at 23°C allows time for positioning and adjustment of multi-part assemblies before the adhesive begins to gel.
- Primer-free bonding: Direct application to cleaned metal, composite, or wood surfaces eliminates a separate priming step in your workflow.
- No exothermic hazard: The cure chemistry does not generate a hazardous exothermic reaction, which simplifies handling procedures for larger bond volumes.
- Room-temperature cure: No oven or elevated-temperature cure equipment is required, though cure kinetics are temperature-dependent — cooler environments will extend working and cure times.
Buyer FAQ
What mix ratio and dispensing equipment does this adhesive require?
This is a 1:1 by weight two-part system. It can be dispensed using dual-cartridge dispensers with static mixing nozzles or metered mixing equipment. The thixotropic paste viscosity supports both manual and automated dispensing.
How long is the working time, and when can bonded parts be handled?
Pot life is 25 minutes at 23°C. Handling strength is achieved in 4 hours. Full cure requires 24 hours at room temperature. Both times are temperature-dependent and will lengthen at lower ambient temperatures.
What structural performance can I expect on steel substrates?
Tensile shear strength is specified at 20+ MPa (20 MPa minimum) when bonded to steel. Performance on other substrates depends on surface preparation, bond line thickness, and cure conditions. We recommend testing under your actual application conditions.
Which substrates are compatible, and is surface primer required?
The adhesive is formulated to bond metals, composites, and wood without primers. Substrate surfaces should be clean, dry, and free of oils or contaminants. For specific substrate combinations not listed, please confirm compatibility with our technical team.
Is this adhesive certified for aerospace or regulated applications?
This product is labeled for aerospace assembly and structural bonding. The manufacturer, TIANJIN SHENGWANG ELECTRONIC CHEMICAL PLANT, operates under ISO 9001:2015-certified quality management systems. Product-specific certifications or qualification documents beyond ISO 9001 are available upon request.
What packaging sizes and order quantities are available?
Packaging configurations and minimum order quantities are available upon request. Please contact us with your volume requirements and preferred packaging format.
Can the formulation or packaging be customized for my project?
Custom formulation adjustments and packaging configurations may be possible depending on volume and technical requirements. Share your project specifications with our team for evaluation.
Manufacturer Backing
This two-part epoxy structural adhesive is manufactured by TIANJIN SHENGWANG ELECTRONIC CHEMICAL PLANT (SW ADHESIVE / FREE BIRD®), an industrial adhesive and electronic chemical products manufacturer based in Tianjin, China. Founded in 1993, the company produces industrial adhesives, sealants, and electronic chemical products for global B2B buyers and maintains ISO 9001:2015 certification for its quality management system.
Production line shown above is the manufacturer's adhesive manufacturing facility. Product-specific batch records and quality documentation available upon request.est.
Request a Quote for Your Structural Bonding Project
To receive an accurate quotation and product recommendation, include your required order volume, bonding substrates, application environment (temperature and load conditions), and any specific packaging or documentation requirements. Our technical sales team will review your specifications and respond with a tailored proposal.
Request Product Details & Quotationtion
